Albany, NY -- (SBWIRE) -- 08/11/2017 -- Globally, electronic device components are being pushed towards micro spatially demanding structures. With the gradual movement towards the limit of Moore's Law, several research and development (R&D) programs are ongoing in pushing the limit of Moore's law. Thin film deposition techniques aid the semiconductor industry in performing the same.

It is a process of creating a thin layer on top of a substrate or on top of another 'thin film'. The thickness of the films can range between nanometers to micrometers. Thin film deposition is currently in very high demand and enormous amount of R&D is also ongoing to develop the process further. It is currently being used for various different applications, such as printed electronics, energy generation, optical coatings and energy storage among others.

Thin film deposition process can be broadly divided in to Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD). Atomic Layer Deposition (ALD) is considered to be a type of CVD. Both CVD and PVD have various different techniques, advantages and disadvantages. Additionally, continuing technological advancements, has led to the possibility of deposition of different materials on required substrates.

Growing application of Atomic Layer Deposition (ALD) thin film coating techniques in the fabrication of a variety of electronic devices and components in the semiconductor industry is one of the major driving factors of the market.

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ALD technique can also be used to encapsulate devices against oxygen, moisture, and impurities in order to ensure long and failure-free operation. Apart from this, ALD has potential applications in industrial production processes which include biocompatible coatings for medical applications, solar cell efficiency enhancement, anti-tarnishing of coins and jewelry, and powder-based catalyst materials among others.

Based on type, the market is segmented intoAluminum Oxide (Al2O3) ALD, Catalytic ALD, Metal ALD, ALD on Polymers and others.Alumina is one of the most studied ALD coated material. Aluminum oxide (Al2O3) is a highly robust and stable material, and has been extensively researched for a wide range of applications in micro and optoelectronics.Furthermore, by application the market is segmented into semiconductor and electronics and research and development facilities.

Geographically, the global atomic layer deposition equipment market is categorized into North America, Europe, Asia Pacific, Latin America, Middle East and Africa. The scope of the report offers an insight into ALD equipment market in these regions based on revenue (USD million).

The competitive profiling of the key players in the global ALD equipmentmarket across major geographic regions is included in the study. These include diverse business strategies adopted by the leading players and their recent developments as in the field of ALD equipment.

A comprehensive analysis of the market dynamics that is inclusive of market drivers, restraints and opportunities is included in the purview of the report. Market dynamics are the distinctive factors which impact the market growth, thereby helping to understand the ongoing trends of the global market. The report provides the forecast of the global market for the period from 2016 to 2024, along with offering an inclusive study of the ALD equipment market.

This 263 page report gives readers a comprehensive overview of the Atomic Layer Deposition Equipment Market. Browse through 41 data tables and 33 figures to unlock the hidden opportunities in this market:

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Technology innovation and development is one of the key strategies adopted by most leading players. New product innovation is required to deal with the existing competition in the market. Some major players in the atomic layer deposition equipment market in Asia Pacific, North America, Europe, Latin America, Middle East and Africa include ASM International N.V. (The Netherlands), Aixtron SE (Germany), Entegris, Inc.(The U.S.), Picosun Oy (Finland), CVD Equipment Corporation (The U.S.), Arradiance, Inc.(The U.S.), ALD Nanosolutions, Inc.

(The U.S.), Beneq Oy (Finland), Veeco Instruments, Inc. (The U.S.), Applied Materials, Inc. (The U.S.), Oxford Instruments Plc (U.K.), SENTECH Instruments GmbH (Germany),Encapsulix (France), Kurt J. Lesker Company (The U.S.), Ultratech Inc. (The U.S) among others.